With the highest standards of quality and traceability, Elettronica GmbH decided to implement its own production line for PCB assembly and test in 2014. The Mydata MY200LXe14 pick & place assembly machine builds ladder platform prototypes. Our entire SMT process is supported by the Ascon VP1000 vapor phase soldering systems, the Conceptronic F3000 BGA desuperheating systems and the screen and stencil printer DEK Horizon 8, which allows manufacturing using the latest component technology. Our state-of-the-art machinery for PCB placement assists us to ensure high quality of the service.

The main elements of our complex PCB mounting system are:

• SOIC, PLCC, TSOP, QFP, DPACK
• Flip chip
• CSP, CHIPS with 0.2 mm pitch
• BGA with 0.3 mm pitch
• μBGA, 01005, 0201, 0402
• Tailor-made thermal process technology
• Automatic optical inspection (AOI)
• X-ray test YXLON Cheetah
• No clean process and ultrasonic cleaning
• Boundary Scan (Boundary Scan)
• In-circuit test (in-circuit test)

To ensure product conformity, all complex circuit board assemblies and electro-mechanical assemblies are subject to our careful testing. The production monitoring is carried out by experienced quality engineers using the automatic optical inspection systems (AOI) and the latest  X-Ray.

Our expert team is also responsible for material management and planning so you do not have to worry. We procure all components directly from the manufacturer, which greatly reduces the time for production.

We offer SMD and THT placement of PCBs.

All circuit boards we have manufactured are under warranty. 

We offer the functional test of the printed circuit boards.